RD-500III & RD-500SIII

BGA返修系统

 



 

     


            









SD-3500

Connector Removal Machine

  

Hot Air Reflow Heating Source

- Prevents Dissolution of PCB Lands and using N2 Will Reduce Oxidation.
- Eliminates the need for solder replacement,
   only requires electricity and air.

Built-in Preheater
- No Need for Separate Preheat which Significantly Reduces Board Stress.


Compact Front Control Panel
Smartly arranged front panel allows for quick start-up and use.

7 Segment LED Display
Equipped with a 7 segment display that shows temperature and a variety of other errors. Allows confirmation of the work.

External Thermo-couple Input
Solder melt temperature can be measured by connecting a K-type thermocouple to the solder area. Allows for a more controlled method of working instead of working by "feel."

Internal Memory and Security Functions
Up to 10 different profiles can be stored into memory and called up with a simple touch of a button. Unauthorized change of a profile can be prevented by using the security setting which prevents the user from changing the profile.                               

RF-460

桌上型6区远红外线式无铅制程迴焊炉

 

RF-460L

桌上型 6 区热风+远红外线式无铅制程氮气迴焊炉

 

 

 

 









 

 

 

 

 

 

 

RF-810

桌上型8区热风+远红外线式无铅制程氮气迴焊炉

Sonic N&A Series Reflow

无铅制程迴焊炉

设备主体外观

设备规格表


设备尺寸图



SLIM KIC2000实际测试曲线图